It won’t be much until the first rumors about the Samsung Galaxy S9 will start circulating, considering that it’s been a few months since its predecessor was unveiled.
Until now, the trail was pretty cold, as the only thing we knew was that it will have a dual lens camera on the back, like the Galaxy Note 8, alongside a fingerprint scanner. However, it looks like the flagship will have a serious amount of processing power under the hood, thanks to the new Snapdragon 845.
LG isn’t happy about this! Again…
According to BGR, Samsung already obtained exclusivity for Qualcomm’s upcoming top-of-the-line chip.
On the other side, the manufacturer also unveiled its next-gen Exynos chip, supposed to power both the Galaxy S9 and Note 9, alongside a new camera which should allow them, as well as other smartphone companies using it, to come up with even thinner devices.
Speaking about the Exynos 9 Series 9180 chip, by his full name, it has 3rd generation custom CPU cores, an upgraded GPU and gigabit LTE modem with industry-first 6CA support. As for the chip itself, it’s build on 2nd generation 10nm process technology.
More MP, less width
As for the camera, it goes by the name of Samsung ISOCELL Slim 2XT and it’s a 24MP image sensor with 0.9μm pixels, basically the smallest in the industry. It also relies on Tetracell and remosaic technology, simulating bigger pixel performance.
this combination allows a 24MP sensor to be fitted in a smaller camera module, so expect to see some ridiculously thin Samsung models next year, including the Galaxy S9, with high-end cameras.
Of course, it’s worth mentioning that Samsung didn’t say anything about the Galaxy S9 while making these announcements, but it’s obvious that their high-end model for 2018 will feature these improvements under the hood.